An illustrative concept depicting a grounding connection that employs ONE-HAND MIXING® conductive adhesive to electrically link an enclosure shield to PCB GND without the need for soldering.
Pelnox is investigating the use of conductive adhesive for grounding, GND, and EMI shielding connections in situations where conventional attachment methods may pose design difficulties.
HADANO-SHI, KANAGAWA, JAPAN, August 18, 2026 /EINPresswire.com/ — PELNOX, Ltd. has announced that it is currently evaluating ONE-HAND MIXING®, a two-part conductive adhesive integrated with a mixer, for ground (GND) connections, EMI shield attachment, and other conductive bonding uses within electronic devices.
Ground connections within electronic devices are essential to product design, providing electrical continuity between enclosures, shielding components, PCB ground planes, cable shields, and other conductive elements. Beyond serving as a current return path, grounding contributes to EMI/EMC performance, electrostatic discharge (ESD) protection, and maintaining a stable reference potential—factors that can affect signal integrity in medical, industrial, measurement, and communications equipment.
Historically, these connections have been achieved through soldering, screws or studs, spring contacts, and conductive gaskets. These established techniques will remain primary solutions. However, the growing trend toward smaller, lighter electronic products, increased use of plastic and plated-plastic enclosures, and broader adoption of heat-sensitive parts such as flexible printed circuits (FPCs) and sensors has created connection points where conventional approaches may be challenging to implement.
For instance, plated-plastic housings may not offer conductive paths equivalent to metal enclosures. The heat from soldering can damage plastic components, FPCs, or plated surfaces. Adding screws or studs can raise weight, component count, and assembly duration, whereas spring contacts and conductive gaskets demand precise control over contact pressure, alignment, and long-term contact stability. In tight corners, curved surfaces, or ultra-thin enclosures, the design options for mechanical fastening may be constrained.
Against this backdrop, Pelnox is examining conductive adhesives as a possible supplement to soldering and mechanical fastening for grounding, GND connections, and EMI shield bonding inside electronic devices.
A conductive adhesive can deliver both electrical connection and mechanical bonding in a single operation, without requiring soldering heat, making it a viable option for locations where traditional joining techniques are difficult to employ.
During this evaluation, Pelnox pinpointed a practical challenge that is especially critical in small bonding areas: consistency in preparation and application.
Ground connections inside electronic devices typically demand only a small amount of adhesive applied to a precise spot. Consequently, slight variations in mixing ratio or incomplete mixing can manifest as variations in contact resistance. The weighing and manual mixing steps needed for conventional two-part conductive adhesive systems can therefore become a burden not only on production lines, but also during prototyping, maintenance, and repair work.
To tackle these issues, Pelnox proposes ONE-HAND MIXING®, a two-part conductive adhesive built around a mixer-integrated cartridge.
The cartridge comes pre-filled with resin and hardener, which are automatically blended inside the static mixer during dispensing. This design eliminates weighing and manual mixing, helps reduce operator-dependent variation, and allows the adhesive to be dispensed in dots or continuous beads only where needed. Because the material cures at room temperature, it can also be evaluated for components where exposure to soldering heat is undesirable.
Conductive adhesives are not intended to replace every grounding method. For applications governed by product safety standards, including protective grounding or safety grounding, conductive adhesive alone does not ensure compliance with applicable requirements. Verification should be performed with the actual device structure and, where required, in combination with mechanical fastening and redundant grounding paths.
Application-specific evaluation remains essential. Key items include contact resistance, adhesion strength, long-term stability under temperature, humidity, and vibration, and system-level EMC performance in the finished product.
Pelnox intends to continue building evaluation data for plated-plastic housings, metal enclosures, PCB ground connections, shielding components, and cable shield terminations. The company plans to share these findings as application-specific technical information to support product development.
Although ground connections inside electronic devices are rarely visible, they constitute a fundamental part of product quality and performance. If the designer’s toolbox expands beyond soldering and mechanical fastening to include a third option—dispense and bond—engineers may gain greater flexibility when designing the next generation of electronic devices.
About Pelnox, Ltd.
Pelnox, Ltd. manufactures and supplies epoxy, polyurethane, silicone, and conductive resin products for electrical and electronic components, serving customers in Japan, Asia, and markets worldwide.
Company: Pelnox, Ltd.
Head Office: 8-7 Bodai, Hadano, Kanagawa, Japan
President: Tatsuya Okumura
Established: 1970
Contact
New Business Development Department
Pelnox, Ltd.
Email: one-hand_mixing@pelnox.co.jp
ONE-HAND MIXING® website: https://sites.google.com/view/one-handmixing//language-english
Isao YAMAMURA
PELNOX, LTD.
463-86-8002
yamamura@pelnox.co.jp
